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Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant

Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant

Categories Thermal Conductive Pad
Brand Name: ZIITEK
Model Number: TIF™500S Series
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Construction & Compostion: Ceramic filled silicone rubber
Thermal conductivity: 3.0W/m-K
Hardness: 45 Shore 00
Specific Gravity: 2.75 g/cc
Continuos Use Temp: -50 to 200℃
Dielectric Breakdown Voltage: >10000 VAC
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    Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant

    Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant

    The TIF™500S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

    Features

    > Good thermal conductive: 3.0 W/mK
    > Naturally tacky needing no further adhesive coating
    > Soft and Compressible for low stress applications
    > Available in varies thickness

    Applications

    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    Typical Properties of TIF™500S Series
    Color

    Blue

    VisualComposite ThicknesshermalImpedance
    @10psi
    (℃-in²/W)
    Construction &
    Compostion
    Ceramic filled silicone rubber
    ***10mils / 0.254 mm0.36
    20mils / 0.508 mm0.41
    Specific Gravity
    2.75 g/ccASTM D297

    30mils / 0.762 mm

    0.47

    40mils / 1.016 mm

    0.52
    Heat Capacity
    1 l /g-KASTM C351

    50mils / 1.270 mm

    0.58

    60mils / 1.524 mm

    0.65

    Hardness
    45 Shore 00ASTM 2240

    70mils / 1.778 mm

    0.72

    80mils / 2.032 mm

    0.79
    Tensile Strength

    45 psi

    ASTM D412

    90mils / 2.286 mm

    0.87

    100mils / 2.540 mm

    0.94
    Continuos Use Temp
    -50 to 200℃

    ***

    110mils / 2.794 mm

    1.01

    120mils / 3.048 mm

    1.09
    Dielectric Breakdown Voltage
    >10000 VACASTM D149

    130mils / 3.302mm

    1.17

    140mils / 3.556 mm

    1.24
    Dielectric Constant
    5.5 MHzASTM D150

    150mils / 3.810 mm

    1.34

    160mils / 4.064 mm

    1.42
    Volume Resistivity
    7.8X10" Ohm-meterASTM D257

    170mils / 4.318 mm

    1.50

    180mils / 4.572 mm

    1.60
    Fire rating
    94 V0

    equivalent UL

    190mils / 4.826 mm

    1.68

    200mils / 5.080 mm

    1.77
    Thermal conductivity
    3.0 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
    Quality Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant for sale
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